ModuleXpert
Performs root cause analysis, defect differentiation and quantification.
LBIC Specifications
| Lateral Scan Resolution | 250 and 500 micron |
| LASER | Diode laser |
| LASER Wavelength | 650 nm or 808 nm (Selectable) |
| LASER Power | < 20 mW (Variable) |
| LASER Spot Size | 50 micron |
| Imaging Lens | High Optical Quality F-theta Scan Lens |
| I-V converter | Low noise current amplifier 1 uA/V to 1 mA/V |
| DAQ | 8 Bit Digitizer (1 Giga samples per second) 100 MHz bandwidth |
EL Specification
| EL/PL Camera sensor type | CMOS or CCD |
| EL/PL Camera sensor resolution | up to 24 MP |
| Module Voltage and Current | 60 V, 20 A |
| Camera Configuration | 1 to 4 Camera setup available |
| Exposure Time | 1-60 s |
| Filter | Visible light filter |
PL Specification
| EL/PL Camera sensor type | CMOS or CCD |
| EL/PL Camera sensor resolution | up to 24 MP |
| Excitation | Up to 20 W/m2 |
| Excitation wavelength | Up to 600 nm |
| Camera Configuration | Single Camera Scanning |
| Exposure Time | 1-60 s |
Thermal Imaging Specification
| Thermal Camera sensor type | Uncooled Bolometer |
| Thermal Camera Sensor Resolution | 320 by 240 |
| Camera Configuration | Single Camera Scanning |
| Sensor wavelength range | 7.5 to 14 micron |
General Specification
| User Interface | Full instrument control and data analysis |
| Imaging Area | Standard 2.5 m by 1.5 m, custom area available |
| Module loading | Conveyor system |
| Environmental isolation | Light tight enclosure with access ports |
| Power requirements | Up to 1 KW |